发明名称 |
AQUEOUS, ACID BATH AND METHOD FOR THE ELECTROLYTIC DEPOSITION OF COPPER |
摘要 |
To generate a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches, an aqueous, acid bath for the electrolytic deposition of copper is provided, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein at least one leveler compound is selected from the group comprising synthetically produced non-functionalized peptides and synthetically produced functionalized peptides and synthetically produced functionalized amino acids. |
申请公布号 |
WO2009132861(A3) |
申请公布日期 |
2010.04.15 |
申请号 |
WO2009EP03353 |
申请日期 |
2009.04.27 |
申请人 |
ATOTECH DEUTSCHLAND GMBH;BRUNNER, HEIKO;ROELFS, BERND;ROHDE, DIRK;PLIET, THOMAS |
发明人 |
BRUNNER, HEIKO;ROELFS, BERND;ROHDE, DIRK;PLIET, THOMAS |
分类号 |
C25D3/38;C25D5/18;H05K3/24;H05K3/42 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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