| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package, an electronic device and a method of manufacturing a printed circuit board, capable of reinforcing the connections of a surface mounted type electronic component and a board without changing the manufacture process of the printed circuit board. <P>SOLUTION: Just by applying an adhesion member 303 to be softened to a temperature for soldering a solder ball 302 to the board 7 and to be cured by cooling to bond the electronic component 301 and the board 7 at four corners of a base 301a which is the lower surface of the electronic component 301 to be electrically connected with the board 7 through the solder ball 302, the connections of the semiconductor package 8 and the board 7 is reinforced. Thus, the connections of the semiconductor package 8 and the board 7 are reinforced without providing a step of applying the adhesion member 303 and a step of curing the adhesion member 303. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
