| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a piezoelectric device with good soldering junction and good conductance by forming an external electrode layer so as to cover a sealing material after sealing through-holes by the sealing material. <P>SOLUTION: The piezoelectric device (100) is a piezoelectric device combining a lid (10), a piezoelectric plate (20) including a piezoelectric vibrating piece forming exciting electrodes and lead-out electrodes, and a base (40) with through-holes (TH). And, the base prepares: connection electrodes (42, 44) connected to the lead-out electrodes in the piezoelectric plate side; through-hole electrodes (15) which conduct with the connection electrodes and are formed on the through-holes; a first external electrode layer (50) which conducts with the through-hole electrodes, and is formed in the opposite face of the piezoelectric plate; the sealing material (70) which seals the through-hole electrodes; and a second external electrode layer (50a) formed so as to cover the first external electrode layer (50) and the sealing material (70). <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
