| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface processing method that prevents dust from being produced by improving the adherence of a film attached on a susceptor. Ž<P>SOLUTION: The surface processing method includes a step (H) of blasting a surface of the susceptor consisting principally of SiO<SB>2</SB>using SiO<SB>2</SB>or SiC, and a step (I) of etching the susceptor surface. The susceptor includes a susceptor body and a level difference portion provided on the susceptor body to support the substrate from the bottom, the level difference portion being formed of a size smaller than the substrate. In a step of masking, the level difference portion is masked preferably to avoid conduction between an end of the substrate and the susceptor body. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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