发明名称 VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus which surely detects the occurrence of clogging in a flow rate sensor due to an organic gas, while preventing the increase of introduction and maintenance costs of the vapor deposition apparatus. SOLUTION: The vapor deposition apparatus has: a first flow-rate control section which controls a flow rate of a bubbling gas to be supplied to a tank 160 and includes a first flow-rate sensor for measuring the flow rate of the bubbling gas; a second flow-rate control section which controls a flow rate of the organic gas to be supplied to a vapor deposition chamber from the tank 160 and includes a second flow-rate sensor for measuring the flow rate of the organic gas; and a control section for controlling the first and the second flow rate control sections. The control section commands the first flow-rate control section to control the flow rate so that a tank pressure becomes a target tank pressure; calculates an amount of the change of the pressure in the tank as a theoretical amount of the change of the tank pressure from the flow rate of the bubbling gas measured by the first flow-rate sensor, the flow rate of the organic gas 180 measured by the second flow-rate sensor, a temperature of the tank and a volumetric capacity of a gas phase part; determines an actual amount of the change of the tank pressure as an actual tank pressure change amount; and if the difference of the amount of changes is not in a predetermined acceptable range, judges that abnormality has occurred. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010084194(A) 申请公布日期 2010.04.15
申请号 JP20080254563 申请日期 2008.09.30
申请人 HOYA CORP 发明人 TAKAHASHI YUKIHIRO
分类号 C23C14/24 主分类号 C23C14/24
代理机构 代理人
主权项
地址