COOLING STRUCTURE FOR ELECTRONIC DEVICE, AND A METHOD

摘要

This invention relates to a cooling structure for an electronic device including an inlet (1) for conveying a flow in a first flow direction (2) towards a first com- ponent (3) and an outlet (4) for conveying the flow further. In order to prevent dirt particles from proceeding to electronic components the cooling structure includes: a second flow channel (5), which starts from the port (7) oriented transversely to the first flow direction (2) or away therefrom and receiving part of the flow from the inlet (1) and which conveys said part of the flow to an elec- tronic component (8) locating in the second flow channel (5).