发明名称 VAPOR DEPOSITION SYSTEM AND VAPOR DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition system where a purge gas is discharged to a growth chamber without passing through the inside of a shower head, thus a raw material gas does not stick to the surface on the cover plate side in the shower head, time, effort and cost taken for the production of a shower head are reduced, and also, maintenance is excellent, and to provide a vapor deposition method. SOLUTION: The space between a shower head 20 and a cover plate 30 is provided with a purge gas distribution chamber 32a into which a purge gas is introduced, and the purge gas distribution chamber 32a is provided with a communication tube 31d making a plurality of raw material gas flow passages 21b in the shower head 20 and a plate raw material gas flow passage 31b in the cover plate 30 communicate with each other. The region other than the plate raw material gas flow passage 31b in the cover plate 30 is provided with a plate purge gas flow passage 32b feeding the purge gas in the purge gas distribution chamber 32a to the growth chamber 7. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010084190(A) 申请公布日期 2010.04.15
申请号 JP20080254395 申请日期 2008.09.30
申请人 SHARP CORP 发明人 WAKASA KANAKO
分类号 C23C16/455;C23C16/30;C23C16/34;C30B28/14;C30B29/40;H01L21/205 主分类号 C23C16/455
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