| 摘要 |
Disclosed is a multi-layer ceramic substrate including a glass ceramic and an external terminal formed on a surface of the glass ceramic. The external terminal includes conductive materials mainly composed of at least one among Ag, Au, Pt and Pd, and added with at least one element among Bi, Cu, Ge, Mn, Ti and Zn. Inorganic oxide particles are provided on a surface of the external terminal. The multi-layer ceramic substrate can keep adhesive strength being unchanged after humidity test or after plating and can prevent plating sag and solder leach from occurring.
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