| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit arrangement in which the main surface of a semiconductor element is coated with a thin sealing resin. SOLUTION: A semiconductor wafer 20 where an external connection electrode 16 is formed is housed in a cavity 36 of metal molds 32 and 34, and a resin sheet 42 containing a thermo-setting resin is interposed between the semiconductor wafer 20 and the lower surface of the inner wall of the metal mold 34. Under this condition, the metal mold is heated at around 180°C, and by injecting a liquid sealing resin from a gate 44, the upper surface of a semiconductor wafer 20 is covered with the injected first sealing resin while the lower surface of the semiconductor wafer 20 is covered with the second sealing resin 14B containing a molten resin sheet 42. COPYRIGHT: (C)2010,JPO&INPIT |
