| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency package device in which the resonance frequency of a metal seal ring is high, a reflection loss and an insertion loss of an input terminal and an output terminal are reduced in working frequency, and which has an excellent RF characteristic in such as a millimeter wave, and to provide a manufacturing method for the same. <P>SOLUTION: The high frequency package device has an conductor base plate 22, a ceramic frame 16 arranged on the conductor base plate 22, the metal seal ring 15 arranged on the ceramic frame 16, a solder metal layer 14 arranged on the metal seal ring 15, a resonance frequency adjustment conductor 12 formed of a conductor having an opening 11 arranged on the solder metal layer 14, and a ceramic cap 10 arranged on the resonance frequency adjustment conductor 12. The resonance frequency adjustment conductor 12 is arranged so that an opening 11 may correspond to a high portion of a loop of bonding wire 30 used inside the ceramic frame 16. <P>COPYRIGHT: (C)2010,JPO&INPIT |
