| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein, when collecting images of defects on a semiconductor wafer by a review SEM, throughput performance and defect detection performance are in a trade-off relationship, and thereby various condition settings (recipe settings) are manually carried out currently. SOLUTION: A review SEM is equipped with: a means to store an image set acquired in a plurality of imaging conditions, or an image set acquired by simulating the plurality of imaging conditions by simulation; a means to store defect position information for each image set; and a means to store information relating to the imaging conditions and a processing time. The review SEM is further equipped with a means to estimate prediction defect detection performance and throughput on an imaging condition basis for the image set from the stored information pieces, and a means to display the result thereof. COPYRIGHT: (C)2010,JPO&INPIT
|
