| 摘要 |
An electromagnetic field analysis of a semiconductor package with a semiconductor chip mounted thereon can be performed simply with a high accuracy. First modeling and second modeling of the semiconductor package with the semiconductor chip mounted thereon are carried out, thereby performing first and second electromagnetic field analyses. Results of the first and second electromagnetic field analyses are synthesized to determine electrical characteristics of the semiconductor package. Specifically, an inductance analysis is performed with the entire semiconductor chip regarded as a dielectric, thereby determining an inductance component of an equivalent circuit. A capacitance analysis is performed with the semiconductor chip regarded as a dielectric having a metal thin film on its surface, thereby determining a capacitance component of an equivalent circuit. Results of the inductance analysis and the capacitance analysis are synthesized to determine an equivalent circuit.
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