| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing resin composition with a high bonding property with respect to a preplating frame made of Pd-Au, Ag, and the like, a high reliability in a long term use such as the excellent moisture resistance after infrared re-flow, and the like, and a good molding property, and a highly reliable apparatus for encapsulating a semiconductor. SOLUTION: The sealing resin composition contains as the essential components (A) an epoxy resin, (B) a phenol resin, (C) an organic compound including 2 to 4 sulfur atoms present continuously in a molecule, (D) a triphenyl phosphine, and (E) an inorganic filler. With respect to the entire resin composition, the component (C) is included by 0.01-5 wt.%, the component (D) by 0.001-1 wt.%, and the component (E) by 25-95 wt.%. The apparatus for encapsulating a semiconductor is for sealing a semiconductor device with a cured product thereof. COPYRIGHT: (C)2010,JPO&INPIT |
