发明名称 RESIN SHEET FOR CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE RESIN SHEET
摘要 <p>A resin sheet (100) is provided with a resin layer (120), and a protection layer (110) laminated on one surface of the resin layer (120). The resin sheet (100) has a rectangular shape in plane view. The outer side section of the protection layer (110) extends outward from the outer side section of the resin layer (120).The resin layer (120) is provided with a flat section (121), and a slope section (122) wherein the thickness of the resin layer (120) gradually reduces toward the external from the flat section (121). A difference between the resin thickness (d), which is of the boundary section (123) between the slope section (122) and the flat section (121) of the resin layer (120), and an average thickness (D) of the flat section (121) is 5% of the average thickness (D) or less.</p>
申请公布号 KR20100039329(A) 申请公布日期 2010.04.15
申请号 KR20107000277 申请日期 2008.07.01
申请人 SUMITOMO BAKELITE COMPANY LIMITED 发明人 MURAKAMI HARUO
分类号 H05K1/03;B05D7/04;B32B27/00;C08J7/04 主分类号 H05K1/03
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