发明名称 METHOD FOR FABRICAING SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE: A method for manufacturing a semiconductor device is provided to improve an operation current of a device by increasing mobility of a carrier hole by applying compressive stress to a channel. CONSTITUTION: A plurality of gate patterns(12) is formed on a substrate(11). An epitaxial silicon germanium layer is formed on a source/drain region of the substrate. Carbon is tilt-ion-implanted to the epitaxial silicon germanium layer.</p>
申请公布号 KR20100038631(A) 申请公布日期 2010.04.15
申请号 KR20080097674 申请日期 2008.10.06
申请人 HYNIX SEMICONDUCTOR INC. 发明人 AHN, TAE HANG;JEON, SEUNG JOON;LEE, YOUNG HO
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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