| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To relax stress at the solder joint of a power module. <P>SOLUTION: The power module 80 is provided, at the bottom thereof, with a metal base 1 and, on the upper surface thereof, with a plurality of terminals 5, 5c and 5e and a plurality of nuts 13. A plurality of circuit boards 2 are mounted on the surface of the metal base 1, and a semiconductor chip 3 is mounted on the surface of the circuit board 2. The circuit board 2 is solder joined to the metal base 1. The terminals 5, 5c and 5e are solder joined to the circuit board 2. The semiconductor chip 3 is connected electrically with the terminals 5, 5c and 5e through a bonding wire 4. A resin holder 6 is provided to be separated from the circuit board 2 and to cover the circuit board 2. A case 8 is provided to cover the side surface of a power module 80 with the lower end touching the end of the metal base 1. A constant interval is kept between the resin holder 6 around the circuit board 2 and the metal base 1 by means of a bolt 12 and the nut 13. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
