发明名称 THERMAL PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide technology for appropriately performing various processing operations on temperature change processing of a thermal processing apparatus in accordance with a facility environment when the apparatus is used. Ž<P>SOLUTION: When a setting temperature of a thermal processing plate 11 is dropped, a control part 40 opens a cooling water bulb 67, supplies cooling water to a cooling plate 21 and cools the thermal processing plate 11. The control part 40 decides a timing for stopping cooling water supply to the cooling plate 21 based on a supply temperature of cooling water obtained from a cooling water temperature sensor 71. The stop timing of cooling water supply is specified by considering the temperature of cooling water. Thus, the optimum stop timing is precisely specified and the time required for heat reduction processing can be shortened. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010087212(A) 申请公布日期 2010.04.15
申请号 JP20080254201 申请日期 2008.09.30
申请人 SOKUDO CO LTD 发明人 NAKANO NOBUYUKI
分类号 H01L21/027 主分类号 H01L21/027
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