| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad for a wafer notch part in which a whisker-like body is peeled off/dropped off before it grows up even if the whisker-like body is generated. Ž<P>SOLUTION: During progressing polishing machining, a part of a fiber of an outer peripheral edge part 11 of the polishing pad 1 is scraped off by the notch part 22, the outer peripheral edge part 11 is fluffed up, and the whisker-like bodies 16, 17 like growing whiskers are started to be formed. When the whisker-like bodies 16, 17 are started to be grown up toward a central side of the polishing pad 1, bases of the whisker-like bodies 16, 17 reach to cut-in parts 145, 155, and the whisker-like bodies 16, 17 are peeled off/dropped off from the polishing pad 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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