发明名称 PROCESS FOR PRODUCING METAL CLAD LAMINATE
摘要 With respect to a metal clad laminate wherein a metal layer is to be formed for at least a part of a surface of a flexible polymer film, it becomes clear that it is able to suppress any warpage of the laminate by performing a heat treatment and then a cooling treatment under a state of loading a tension within a range capable of maintaining the laminate to be a flat configuration consistently during the period from heating to cooling. Moreover, it becomes clear that it is able to suppress the warpage without occurrences of an elongation deformation and/or a fracture for the obtained metal clad laminate, by controlling a tension to be loaded at the period of the heat treatment as between 0.03% and 0.3% of a tensile strength in a direction of the tension for the substratum polymer film.
申请公布号 US2010092680(A1) 申请公布日期 2010.04.15
申请号 US20070311523 申请日期 2007.10.03
申请人 OHGA KENICHI;ZAMA SATORU 发明人 OHGA KENICHI;ZAMA SATORU
分类号 B05D3/02 主分类号 B05D3/02
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