The invention relates to a process for modifying a substrate (10) comprising: (a) providing an initial substrate (10) having a face (10b) for bonding and an opposing face (10r); (b) providing a support substrate (25); wherein either the bonding face (10b) of the initial substrate (10), and/or a face of the support substrate (25), is provided with an electromagnetic radiation absorbing layer (24), wherein the support substrate (25) is substantially transparent to a wavelength of electromagnetic radiation (c) performing bonding to join the bonding face (10b) of the initial substrate (10) to the support substrate (25) via the electromagnetic radiation absorbing layer (24); (e) carrying out irradiation of the electromagnetic radiation absorbing layer (24) through the substantially transparent support substrate (25) to induce separation of the support substrate (25).
申请公布号
WO2010015878(A3)
申请公布日期
2010.04.15
申请号
WO2008IB03101
申请日期
2008.09.08
申请人
S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES;PHILIPS LUMILEDS LIGHTING COMPANY LLC;FAURE, BRUCE;LETERTRE, FABRICE;WIERER, JONATHAN, J., JR.
发明人
FAURE, BRUCE;LETERTRE, FABRICE;WIERER, JONATHAN, J., JR.