发明名称 SELECTIVE SOLDER STOP
摘要 A method for producing a surface on a component, which has regions having different wettabilities with respect to a solder. The method includes forming a first metallic layer on the component and forming a second metallic layer on the first metallic layer, the second metallic layer preventing oxidation of the first metallic layer. The method furthermore includes removing the second metallic layer with the aid of a laser in a predefined surface region for exposing the first metallic layer, and oxidizing the exposed first metallic layer on the surface, which results in a wettability with respect to a solder in the predefined surface region that is less than in a surface region adjacent to the predefined surface region.
申请公布号 US2010089979(A1) 申请公布日期 2010.04.15
申请号 US20090573181 申请日期 2009.10.05
申请人 发明人 IRSLINGER HANS-MARTIN
分类号 B23K20/24;B23K31/02;B32B38/10 主分类号 B23K20/24
代理机构 代理人
主权项
地址