| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve polishing accuracy by predicting a polishing rate of a product wafer in units wafers, and to reduce a polishing process for a test wafer. <P>SOLUTION: An apparatus data measuring means 10 collects temperature data of a polishing pad and torque data of a conditioner. A consumable supplies data managing means 11 manages an accumulated usage time after exchange of the polishing pad, a wafer supporting member of a polishing head, and a conditioner disk of the conditioner. A film thickness measuring means 12 measures a film thickness of a test wafer before and after polishing, and an estimated model calculating means 14 calculates an actual polishing rate. The estimated model calculating means calculates a polishing rate estimating model expression by multi-regression analysis based on the polishing rate of the estimated model calculating means 14, the apparatus data of the apparatus data measuring means 10, and the consumable supplies data of the consumable supplies data managing means 11. A polishing rate managing means 15 estimates the polishing rate from the data managed by the apparatus data measuring means 10 and the consumable supplies data managing means 11 and the estimating model expression in polishing a product wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
