| 发明名称 |
RESIN SHEET AND METHOD OF MANUFACTURING CIRCUIT DEVICE USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sheet for suppressing occurrence of voids in resin-sealing, and to provide a method of manufacturing a circuit device using the resin sheet. <P>SOLUTION: The resin sheet 10 is formed by pressurization processing of a powder-like resin material containing a thermosetting resin. The resin sheet 10 (52) is disposed inside a cavity 46 of a mold die 40 along with a circuit element when resin-sealing the circuit element by the mold die 40. Then, by melting and then heating and curing, one portion of resin sealing for sealing the circuit element is composed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| 申请公布号 |
JP2010086993(A) |
申请公布日期 |
2010.04.15 |
| 申请号 |
JP20080250912 |
申请日期 |
2008.09.29 |
| 申请人 |
SANYO ELECTRIC CO LTD;SANYO SEMICONDUCTOR CO LTD |
发明人 |
MOGI MASAMI;KANAKUBO MASARU;MINO KATSUYOSHI |
| 分类号 |
H01L23/29;H01L21/56;H01L23/31 |
主分类号 |
H01L23/29 |
| 代理机构 |
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