| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pressure-contact type semiconductor device such that pressing force applied to a semiconductor chip is uniform. <P>SOLUTION: The pressure-contact type semiconductor device 1 is provided with a plurality of semiconductor chips 13 which are clamped between an electrode plate 11 and an electrode plate 12 and connected to the electrode plates 11 and 12 in parallel with each other, and an insulating member 21 clamped between the electrode plate 11 and electrode plate 12 is disposed at the periphery of an area where those semiconductor chips 13 are arranged. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
