发明名称 CONDUCTIVE INK COMPOSITION AND SOLAR CELL MODULE FORMED USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a conductive ink composition capable of further thinning a width of an electrode and reducing resistance, and to provide a solar cell module where the electrode or an electric wiring is formed using the ink composition. <P>SOLUTION: This conductive ink composition includes a conductive particle and an organic vehicle containing a heat-curable resin composition, a curing agent and a solvent. In the ink composition, as the resin composition, an epoxy resin composition is used that is solid at room temperature and has melt viscosity of≤0.5 Pa s at 150°C, and a content ratio of the heat-curable resin composition to the conductive particle is (2-15):(75-95) in a mass ratio. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010083952(A) 申请公布日期 2010.04.15
申请号 JP20080253039 申请日期 2008.09.30
申请人 MITSUBISHI MATERIALS CORP 发明人 OGAWA REIKO;HAYASHI TOSHIHARU
分类号 C09D11/033;C09D11/10;C09D11/102;C09D11/52;H01B1/22;H01L31/0224;H01L31/04 主分类号 C09D11/033
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