| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device preventing crack and separation in a bonding material from occurring by pinch-holding of a resin part even when a glass lid is employed and a package using a brittle material as a bonding material employed for joint between a package base and the lid is mounted. <P>SOLUTION: This electronic device is a piezoelectric oscillator 10 having a resin part 52 covering the circumference of the package 12 and using the brittle material for joint between the lid 16 and the package base 14 constituting the package 12. The resin part 52 is provided, on the outer periphery of the lid 16, with a burr part 54 formed by reducing the height of the resin part 52 from the outer edge of the upper surface of the lid 16 toward the side face of the resin part 52, and the lower end of the burr part 54 is formed on the lower side relative to the horizontal position of the undersurface of the lid 16. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
