| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive for a multilayer flexible substrate to be used in a line for a printed wiring board, capable of improving the chemical resistance while maintaining the characteristics of a polyamideimide such as high heat resistance, and also to provide a multilayer flexible substrate material, laminate plate and printed wiring board using the same. <P>SOLUTION: The adhesive for a multilayer flexible substrate as a resin composition containing a polyamideimide resin and an epoxy resin includes a polyamideimide resin by 50-85 mass% in the total solid component, an epoxy resin having 2-3 epoxy groups and compatible with a polyamideimide resin, and a resin having 3 or more functional groups reactive with the epoxy groups. Also there are provided a multilayer flexible substrate material, laminate plate and printed wiring board using the adhesive. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
