| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist coating device which uniformly applies misty resist liquid in very fine liquid droplets without evaporating the solvent before the misty resist liquid reaches a surface of the substrate by reducing temperature drift of a wafer substrate mounting base, and rapidly drying and caking the resist after uniformly applied, in a resist spray coating method in which a used amount of resist liquid is very small and the solvent is easily evaporated. Ž<P>SOLUTION: The resist coating device includes: (a) a spin chuck (4) which rotates a mounted wafer substrate (1) and is provided with a mica heater (3) for heating the wafer substrate (1) through a contact part (2) with the wafer substrate (1); (b) an ultrasonic spray nozzle (7) for making resist (L) into mist and spraying on the wafer substrate (1); (c) a temperature measurement part (5) for measuring a heating temperature of the wafer substrate (1); and (d) a feed device (6) which controls the mica heater (3) by a signal from the temperature measurement part (5) without contacting with the spin chuck (4), and feeds the mica heater (3). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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