发明名称 |
OXIDE ETCH WITH NH4-NF3 CHEMISTRY |
摘要 |
The present invention generally provides apparatus and methods for selectively removing various oxides on a semiconductor substrate. One embodiment of the invention provides a method for selectively removing an oxide on a substrate at a desired removal rate using an etching gas mixture. The etching gas mixture comprises a first gas and a second gas, and a ratio of the first gas and a second gas is determined by the desired removal rate.
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申请公布号 |
US2010093151(A1) |
申请公布日期 |
2010.04.15 |
申请号 |
US20090642268 |
申请日期 |
2009.12.18 |
申请人 |
ARGHAVANI REZA;KAO CHIEN-TEH;LU XINLIANG |
发明人 |
ARGHAVANI REZA;KAO CHIEN-TEH;LU XINLIANG |
分类号 |
H01L21/762 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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