| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching defect inspection method of a piezoelectric vibration chip wafer, and an inspection system. SOLUTION: Reference light 32 is reflected by a half mirror 24, and the reference light 32 is irradiated vertically to the piezoelectric vibration chip wafer 12 formed by etching, and reflected light 34 of the reference light 32 reflected by the piezoelectric vibration chip wafer 12 and transmitted through the half mirror 24 is photographed, and a domain of low-intensity reflected light 34 in the photographed image is detected as an etching defect 14 formed in the piezoelectric vibration chip wafer 12. COPYRIGHT: (C)2010,JPO&INPIT |
