Halbleiter-Leuchteinheit und Verfahren zur Herstellung derselben

摘要

A substrate (2) is designed as a printed circuit board with structured conductor strips. A connection for a semiconductor component (SC) or luminous diode (3) makes electrical contact with an adjacent SC or a conductor strip that leads to an external connection (9). Designed as a chip with its connectors connected to conductor strips by means of bonding wires, the SC is covered by a sealing compound (4). An Independent claim is also included for a method for producing a semiconductor luminous device and fitting multiple components on a substrate.