| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device and a method of manufacturing the same which can achieve high connection reliability without degrading electrical characteristics. SOLUTION: The electronic device includes a substrate, an electronic device mounted on the substrate via bumps, and molding resin disposed between the substrate and the electronic device. The electronic device has a first pad electrically connected to the bump. The substrate has a conductive resin layer. The conductive resin layer has a second pad electrically connected to the bump and wiring continuously extended from the second pad. The second pad is larger in thickness than the wiring. The second pad is not recessed by the pressing force of the bump. COPYRIGHT: (C)2010,JPO&INPIT |
