| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of heating and cooling a mold for resin encapsulation molding capable of performing resin encapsulation molding of an electronic component such as semiconductor element by using a small-size compression resin encapsulation molding apparatus capable of efficiently and quickly performing a heating and cooling process of both of upper and lower molds in a molding apparatus, and to provide an apparatus for heating and cooling the mold for resin encapsulation molding. SOLUTION: The apparatus for heating and cooling the mold for resin encapsulation molding comprises: cooling means 64, 104 disposed on the upper mold 6 and lower mold 10; and a gate nozzle 15 provided with a cooling means in the upper mold 6. The method of heating and cooling the mold for resin encapsulation molding comprises: a cooling process of cooling both of the upper and lower molds 6, 10 in such a state as to set a gap S for air heat insulation between the upper mold 6 and a heater 52 for heating the upper mold, and the lower mold 10 and a heater 94 for heating the lower mold upon the molding; and a heating process of heating both of the upper and lower molds 6, 10 in such a state as to remove the gap S. By convenient means using a pressure reduction operation and elastic members 63, 103, the switching of setting and release of the gap S, and the switching of heating and cooling of both of the upper and lower molds 6, 10 are quickly performed. COPYRIGHT: (C)2010,JPO&INPIT |
