| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of performing resin encapsulation molding of an electronic component such as semiconductor element by using an apparatus for compression resin encapsulation molding which is miniaturized and is reduced in weight. SOLUTION: Cooling means 64, 104 are respectively disposed on an upper mold 6 and a lower mold 10, a gate nozzle 15 provided with a cooling means 154a is arranged in the upper mold 6 and a single sheet of cavity 106 for loading a substrate is arranged on the lower mold 10. Therein, such a temperature control that, in the state that gaps S for air heat insulation are set between the upper mold 6 and a heater 52 for heating the upper mold, and the lower mold 10 and a heater 94 for heating the lower mold, the upper and lower molds are cooled and further, in the state that the gaps S are removed, both of the upper and lower molds are heated is performed upon molding. Furthermore, by arranging such a mold structure and gate nozzle 15, the apparatus can be miniaturized and is made light-weight and the temperature control adapted for properties of resin material can be performed. COPYRIGHT: (C)2010,JPO&INPIT |
