| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device for joining a wafer joining substrates to each other in a further short time. <P>SOLUTION: This device for joining a wafer includes steps of: holding a first substrate to an upper holding mechanism 7 by applying a voltage to the upper holding mechanism 7; producing a joined substrate by joining the first substrate to a second substrate held to a lower holding mechanism 8; applying a voltage attenuating while alternating to the upper holding mechanism 7 and thereafter dechucking the joined substrate from the upper holding mechanism 7. The joined substrate can be further surely dechucked from the upper holding mechanism 7 in a further short time by applying the voltage attenuating while alternating to the upper holding mechanism 7 to reduce residual suction force to the upper holding mechanism 7. As a result, this device 1 for joining a wafer can join the first substrate to the second substrate in a further shorter time. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
