发明名称 METHOD OF FORMING CONDUCTOR PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of forming a conductor pattern inexpensively forming a conductor pattern uniform in terms of composition with high throughput. Ž<P>SOLUTION: In this method of forming a conductor pattern used for forming the conductor pattern by heating and baking a conductor pattern precursor 4 formed of conductor particles 3 arranged on a substrate 1, the substrate 1 and the conductor pattern precursor 4 are irradiated with light 6 in a wavelength range wherein an absorption index when the light is absorbed in the substrate 1 is smaller than that when the light is absorbed in the conductor pattern precursor 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010087176(A) 申请公布日期 2010.04.15
申请号 JP20080253776 申请日期 2008.09.30
申请人 HITACHI VIA MECHANICS LTD 发明人 SANO YUICHIRO;DOI AKIRA;KISHI MASAKAZU
分类号 H05K3/10 主分类号 H05K3/10
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