| 摘要 |
<P>PROBLEM TO BE SOLVED: To make compact and light-weight the whole device structure of a compression resin seal molding device for seal-molding an electronic component such as a semiconductor element by a liquid thermosetting resin material R. Ž<P>SOLUTION: This compression resin seal molding device is provided with cooling means 64, 104 in an upper molding die 6 and a lower molding die 10, is arranged with a gate nozzle 15 provided with a cooling means 154a in an inside of the upper molding die 6, and is arranged with a single substrate packing cavity 106 in the lower molding die 10. The electronic component on the substrate is immersed into the liquid thermosetting resin material R in the lower molding die cavity 106, by supplying the resin material of prescribed amount into the lower molding die cavity 106 through the gate nozzle 15, and by supplying the substrate between the both upper and lower molding dies 6, 10, followed to mold-clamp the both upper and lower molding dies. The resin material is applied thereafter with prescribed molding die clamping pressure to be compression-molded. A temperature is controlled, when molded, by the cooling means 154a, 64, 104 of the gate nozzle 15 and the both upper and lower molding dies. The device is made compact and light-weight by this molding die structure and the arrangement of the gate nozzle 15. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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