| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized piezoelectric device, having a high mechanical strength, wherein a piezoelectric vibrating reed is not brought into contact with a conductive pattern existent in an area opposite thereto. SOLUTION: Two pieces of drawing wiring 4a, 4b existent in an area opposite to a piezoelectric vibrating reed 2 are disposed in recesses 11a, 11b formed on an inner bottom surface of a package substrate 1 along with plane outer forms thereof. In such a configuration, since the two pieces of drawing wiring 4a, 4b are disposed in the recesses 11a, 11b, so that there is no risk that the piezoelectric vibrating reed 2 is brought into contact with the drawing wiring 4a, 4b. Furthermore, a thickness of the drawing wiring 4a, 4b is settled within a thickness of the package substrate 1, so that the piezoelectric vibrating reed 2 is disposed lower just by the thickness, and the piezoelectric device is small-sized as a whole. Further, since the recesses 11a, 11b are formed only in the area necessarily sufficient for housing the drawing wiring 4a, 4b, the package substrate 1 is prevented from being thinned unnecessarily and the mechanical strength is also prevented from being considerably reduced. COPYRIGHT: (C)2010,JPO&INPIT
|
