| 摘要 |
PURPOSE: A multi chip package is provided to suppress an electric shock by connecting a substrate electrode terminal to a metal pattern connected to an upper chip bonding pad with a metal wire. CONSTITUTION: A substrate(21) comprises a circuit pattern including an electrode terminal(21a) arranged on the upper side and a ball land(21b) arranged on the lower side. A lower chip(22) is arranged on the upper side of the substrate with a face-down type. The lower chip includes a plurality of first bonding pads(22a) on the front side. A first connection unit(23) is formed on the first bonding pad and mechanically and electrically connects the first bonding pad of the lower chip to the electrode terminal. A plurality of metal patterns(29) are arranged on the rear edge of the lower chip. An upper chip(24) is formed on the rear side of the lower chip with a face-down type. The upper chip includes a plurality of second bonding pads on the front side. A second connection unit(25) is formed on the second bonding pad. The second connection unit electrically and mechanically connects the second bonding pad on the upper chip to the metal pattern. A metal wire(26) electrically connects the metal pattern to the electrode terminal. A sealant(27) seals the upper side of the substrate including the upper and lower chips and the metal wire. A mounting unit(28) is formed on the ball land of the lower side of the substrate. |
