| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a lead frame type substrate that reduces failures during assembly without forming a hollow part immediately under a terminal to be connected during wire bonding. <P>SOLUTION: The manufacturing method for the lead frame type substrate includes: (α) a step of forming a photo resist pattern to form a semiconductor device mounting part, a semiconductor device electrode connection terminal, and an external frame respectively on a first face of a metal plate, and also, to form an external connection terminal, an external frame, and each groove for the external frame respectively on a second face of the metal plate; (β) a step of forming each groove of the external frame and each non-through-hole at a metal plate exposed part of the second face by etching; (γ) a step of forming a resin layer made of a premold resin in each hole and each groove by a flat-plate press; and (δ) a step of forming the semiconductor device mounting part, the semiconductor device electrode connection terminal connected with the external connection terminal, and the first external frame of the first face by etching. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
