| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve the bonding of a substrate and a workpiece by heating, when using a bonding member which requires heat for bonding, in a gripping device to grip the workpiece to be mounted on the substrate. Ž<P>SOLUTION: In a gripping members 20a, 20b for gripping a workpiece 30, a photothermal conversion portion 25a, 25b which convert the supplied energy of light into thermal energy are provided, by converting the energy of light supplied to the gripping member into the thermal energy, the heat required for bonding is given to the bonding members 43a, 43b. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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