| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method and a film deposition apparatus obtaining a physically vapor-deposited film of the desired characteristic by irradiating a plurality of evaporation sources comprising a plurality of different materials with plasma beams from a plurality of pressure-gradient type Ar plasma guns. SOLUTION: Each of the plurality of evaporation sources comprising the plurality of different materials is irradiated with plasma beams from the plurality of pressure-gradient type Ar plasma guns for evaporation, the evaporation sources are evaporated and converted into plasma as particles, and a physically vapor-deposited film is deposited on a surface of a substrate, which includes the desired component composition, uniformity, crystal form, adhesiveness, strength, hardness or the like. COPYRIGHT: (C)2010,JPO&INPIT
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