| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper plating system and a copper plating method for performing high-accuracy electroplating, and recovering and reusing copper ions from electroplating liquid after electroplating to reduce a production cost. Ž<P>SOLUTION: The copper plating system includes: a copper sulphate aqueous solution producing device 20; an additive supply device 30; an electroplating device 40; and a copper ion recovery device 10 which recovers copper ions from electroplating liquid discharged from the electroplating device 40, wherein the copper ion recovery device 10 includes: an ion generation vessel 11; a first barrier membrane 14 which partitions the ion generation vessel 11 into an anode chamber 12 and an intermediate chamber 13 and can permeate hydrogen ions and copper ions; a second barrier membrane 16 which partitions the ion generation vessel 11 into an intermediate chamber 13 and a cathode chamber 15 and can permeated hydrogen ions; an anode 18a disposed on at least the anode chamber 12; and a cathode 17 disposed on the cathode chamber 15, and a delivery path 13a is configured so as to deliver copper ions to at least one of the copper sulphate aqueous solution producing device 20, additive supply device 30 and electroplating device 40. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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