| 发明名称 |
MULTILAYER ELECTRONIC COMPONENT SYSTEMS AND METHODS OF MANUFACTURE |
| 摘要 |
Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.
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| 申请公布号 |
US2010090902(A1) |
申请公布日期 |
2010.04.15 |
| 申请号 |
US20050993890 |
申请日期 |
2005.11.23 |
| 申请人 |
THOMPSON DANE;WANG GUOAN;KINGSLEY NICKOLAS D;PAPAPOLUMEROU IOANNIS;TENTZERIS EMMANOUIL M;BAIRAVASUBRAMANIAN RAMANAN;DEJEAN GERALD;LI RONGLIN |
发明人 |
THOMPSON DANE;WANG GUOAN;KINGSLEY NICKOLAS D.;PAPAPOLUMEROU IOANNIS;TENTZERIS EMMANOUIL M.;BAIRAVASUBRAMANIAN 1 RAMANAN;DEJEAN GERALD;LI RONGLIN |
| 分类号 |
H01Q1/38;H01Q5/00 |
主分类号 |
H01Q1/38 |
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