| 摘要 |
<p>A ceramic chip assembly is provided. The ceramic chip assembly includes a ceramic base, a plurality of external electrodes, a pair of cylindrical metal lead wires, and an insulating protection material. The ceramic base has electrical characteristics of a semiconductor. The pair of external electrodes is oppositely formed on both side surfaces of the ceramic base, respectively. The cylindrical metal lead wire has one end thereof electrically and mechanically connected to the external electrodes by an electrical conductive adhesive, respectively, and has an external diameter identical to or greater than the thickness of the ceramic base. The insulating protection material includes a pair of insulating films and an insulating coating layer.</p> |
