发明名称 |
METHOD FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH |
摘要 |
A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via. |
申请公布号 |
EP2174535(A1) |
申请公布日期 |
2010.04.14 |
申请号 |
EP20070871188 |
申请日期 |
2007.10.19 |
申请人 |
SECOND SIGHT MEDICAL PRODUCTS, INC. |
发明人 |
OK, JERRY;GREENBERG, ROBERT, J. |
分类号 |
H05K3/40 |
主分类号 |
H05K3/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|