发明名称 |
METHOD FOR DEPOSITING POROUS FILMS |
摘要 |
A processing method for depositing porous silica and doped silica films is provided. The method uses a cyclic scheme wherein each cycle comprises first codepositing silica with silicon, then selectively removing the silicon from the codeposit to form a porous structure. In a preferred embodiment, the codeposition is carried out by plasma enhanced chemical vapor deposition. After codeposition, the codeposit is exposed to a selective silicon removal reagent that can preferentially remove the silicon in the codeposit, leaving behind a porous structure. Repeated execution of the codeposition and the selective silicon removal steps build up thickness of the porous film. A porous film with highly uniform small pores and a desired porosity profile can be obtained with this method. This method is advantageous for forming a broad range of low-k dielectrics for semiconductor integrated circuit fabrication. The general method is also advantageous for forming other porous films for other applications. |
申请公布号 |
EP1794785(A4) |
申请公布日期 |
2010.04.14 |
申请号 |
EP20050786383 |
申请日期 |
2005.08.16 |
申请人 |
MAK, CECILIA Y.;LAW, KAM S. |
发明人 |
MAK, CECILIA Y.;LAW, KAM S. |
分类号 |
H01L21/32;H01L21/469 |
主分类号 |
H01L21/32 |
代理机构 |
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代理人 |
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