发明名称
摘要 PROBLEM TO BE SOLVED: To provide a positive type heat resistance photosensitive polymer composition having high sensitivity and ensuring a good pattern shape and a good rate of a residual film in the unexposed part, a method for producing a pattern by which a high resolution pattern having a good shape is obtained by using the composition and electronic parts having high reliability. SOLUTION: The photosensitive polymer composition contains (a) a polyimide precursor or a polyimide soluble in an aqueous alkali solution, (b) a compound which generates an acid under light and (c) a compound having alkoxymethyl and phenolic hydroxyl groups in one molecule.
申请公布号 JP4449159(B2) 申请公布日期 2010.04.14
申请号 JP20000131738 申请日期 2000.04.28
申请人 发明人
分类号 G03F7/004;C08G73/10;C08K5/00;C08K5/02;C08K5/13;C08L79/08;G03F7/023;G03F7/037;H01L21/027;H01L21/312 主分类号 G03F7/004
代理机构 代理人
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