| 发明名称 |
A selective soldering apparatus and a method of pumping solder in a selective soldering apparatus |
| 摘要 |
An impeller type pump (7) in a selective soldering apparatus (1) is positioned so that the surface (S) level of molten solder in the bath adjacent the impeller axle (31) is just below the upper edge (53) of the impeller blades (41). This can reduce the formation of solder dust. |
| 申请公布号 |
GB201003129(D0) |
申请公布日期 |
2010.04.14 |
| 申请号 |
GB20100003129 |
申请日期 |
2008.08.22 |
| 申请人 |
PILLARHOUSE INTERNATIONAL LIMITED |
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