| 摘要 |
PURPOSE: An electrode pad, a conductive pattern, a wiring board, and a manufacturing method thereof are provided to improve the reliability of the wiring board by controlling delamination between the side of an electrode pad and the side of an insulating layer. CONSTITUTION: An electrode pad(25) comprises a first side and a second side located in the opposite side to the first side. A conductive pattern(27,28) is connected to the first side of the electrode pad. An insulating layer(21,22,23) buries the electrode pad and the conductive pattern. The insulating layer covers the peripheral part of the second side of the electrode pad. The insulating layer has an opening(38) exposing a part of the second side. |
